Wafer Edge Grinding Wheels

Lapmaster International is pleased to announce that we are now teamed with Kure-Norton of Japan to provide World-Class Edge-Grinding Wheels, Notching Tools, CMP Pad Conditioning Tools and Back-Grinding Wheels to the Semiconductor and Compound Semiconductor Industries.

Gear-Grinding and Form-Grinding Tooling is also available from the Lapmaster/Kure-Norton team.The Kure-Norton/Lapmaster Team Provides:

• Consistent, World-Class Quality
• Design Flexibility & Innovation
• Competitive Pricing
• Fast and Reliable Delivery
• Local Service and Support

Kure-Norton Features:

• World-Class Semi Supplier
• ISO 9001 Certified
• ISO 14001 Certified (later this year)
• Controls all aspects of Edge-Grinding Wheel manufacturing in-house
• Reduced turn-around time
• Measures and re-grades Diamond & CBN powders in-house to maintain tight Abrasive Distribution & Quality
• Flexible: 11 Bond Types offered 

Bond Types Address Optimization of:

• Enhance Wheel Service Life
• Optimize Edge Surface Finish
• Reduce/Eliminate Edge Chipping
• Accurate Edge Contour/Profile